• Intel's 18A process node represents a significant advancement in foundry technology, featuring innovative RibbonFET transistors and the industry-first PowerVia backside power delivery system, enabling up to 15% better performance per watt and 30% better chip density compared to the Intel 3 node.
• PowerVia, a key differentiator, relocates power delivery to the back of the die, improving density and cell utilization by 5-10% and boosting ISO-power performance by up to 4% by reducing resistive power delivery droop and inherent resistance (IR) drop.
• The RibbonFET GAA transistor technology in Intel 18A offers precise electrical current control, enabling further miniaturization while reducing power leakage, crucial for high-density chips demanding intense computational power like those used in generative AI.
• Intel 18A boasts full support for industry-standard EDA tools and a robust ecosystem of over 35 partners across various sectors, ensuring smooth transitions and broad customer enablement, with tape-outs beginning in the first half of 2025.
• This advanced node, manufactured in North America, provides a resilient supply alternative for customers and is showcased in the Clearwater Forest server processor, demonstrating its potential when combined with Intel's advanced packaging technologies, targeting applications like HPC, AI, and image signal processing.